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Digital POL Module addresses challenge of powering advanced ICs.

2015-03-25 13:31:08| Industrial Newsroom - All News for Today

Outputting 90 A in 50.80 x 9.47 x 19.10 mm vertical and 50.8 x 19.1 x 9.7 mm horizontal through-hole configurations, non-isolated NDM3Z-90 incorporates dynamically programmable digital features. Modules are available with 7.5–14 Vdc input range and 0.6–1.8 Vdc programmable output range. While peaking at 91.4% at 12 Vdc in to 1.0 Vdc out at 50% load, efficiency remains at 88.7% up to full load. Digital power controller with ChargeMode™ Control technology eliminates need for compensation.

Tags: advanced digital challenge addresses

 

Power Management ICs feature 6 DC/DC regulators.

2015-03-24 13:31:07| Industrial Newsroom - All News for Today

Available in 4.5 x 4.5 mm FQFN package, MIC7400/MIC7401 Series combines 5 independent 3 A synchronous buck converters, independent 200 mA non-synchronous boost converter, and numerous programmable features. Devices operate from 2.4–5.5 V input and provide output of 0.8–3.3 V for buck regulators with 1.5% output accuracy over line/load and temperature. Configurable via I2C interface and internal EEPROM, PMICs are suited for SSDs as well as smart-home and IoT devices.

Tags: power management feature regulators

 
 

Worlds smallest STB tuner ICs with integrated loop-through

2015-03-23 22:30:45| Digital TV News

Silicon Labs (NASDAQ: SLAB) has introduced a family of digital set-top box (STB) tuner ICs designed to reduce the cost, complexity and power consumption of cable, terrestrial, hybrid terrestrial/satellite and IP-based STB products.

Tags: integrated worlds tuner smallest

 

Microsemi to Demonstrate Leading-Edge Modulator Driver Amplifiers and Timing ICs for Optical Communication Networks at OFC 2015

2015-03-23 11:31:17| Industrial Newsroom - All News for Today

Exhibition for Electronic Components and Systems Takes Place March 24-26 at the Los Angeles Convention Center WHAT: Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will be participating in the Optical Fiber Communication Conference...

Tags: communication networks driver demonstrate

 

FPGAs, 3D ICs, and MPSoCs suit LTE Advanced applications.

2015-02-26 14:31:38| Industrial Newsroom - All News for Today

Suited for 5G wireless, terabit wired communications, automotive ADAS, and IoT applications, UltraScale+ FPGA portfolio comprises Kintex® UltraScale+ FPGA and Virtex® UltraScale+ FPGA and 3D IC families, while Zynq® UltraScale+ family includes all programmable multi-processing SoCs. UltraRAM, scaling up to 432 Mbits, attacks bottlenecks by enabling SRAM integration. SmartConnect technology applies interconnect topology optimizations to match design-specific throughput and latency requirements.

Tags: advanced applications suit ics

 

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