Home › Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance
 

Keywords :   


Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance

2013-04-17 06:00:00| Industrial Newsroom - All News for Today

On May 20-21 and May 23, 2013, IPC ESTC will feature 8 educational courses examining packaging, materials, design, and assembly considerations in electronics, from bare board to end-product. Courses will take systems approach to sustainable and cradle-to-grave product lifecycles. Examples include: Advanced Packaging; Soldering Technology for Electronics Assembly: Achieving High Yields and Reliability; Simulation Based Reliability Assessment; and PCB Fabrication Basics. This story is related to the following:Trade Associations

Tags: advanced product technology performance

Category:Industrial Goods and Services

Latest from this category

All news
15.09Your MANA RepFinder Profile
Industrial Goods and Services »
28.09Weekly Recap: AkzoNobel, BASF, Axalta, PPG Top This Weeks Stories
28.09Post-Tropical Cyclone Helene Public Advisory Number 20
28.09Hurricane Isaac Graphics
28.09Hurricane Isaac Forecast Discussion Number 10
28.09Hurricane Isaac Wind Speed Probabilities Number 10
28.09Hurricane Isaac Public Advisory Number 10
28.09Summary for Hurricane Isaac (AT5/AL102024)
28.09Hurricane Isaac Forecast Advisory Number 10
More »