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Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance

2013-04-17 06:00:00| Industrial Newsroom - All News for Today

On May 20-21 and May 23, 2013, IPC ESTC will feature 8 educational courses examining packaging, materials, design, and assembly considerations in electronics, from bare board to end-product. Courses will take systems approach to sustainable and cradle-to-grave product lifecycles. Examples include: Advanced Packaging; Soldering Technology for Electronics Assembly: Achieving High Yields and Reliability; Simulation Based Reliability Assessment; and PCB Fabrication Basics. This story is related to the following:Trade Associations

Tags: advanced product technology performance

Category:Industrial Goods and Services

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