Home › EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution
 

Keywords :   


EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution

2014-07-18 10:37:01| electronicsweb Home Page

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled theGEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs)

Tags: group key solution manufacturing

Category:Electronics and Electrical

Latest from this category

All news
»
03.07Hurricane Beryl Graphics
03.07Atlantic Tropical Weather Outlook
03.07Hurricane Beryl Public Advisory Number 17A
03.07Summary for Hurricane Beryl (AT2/AL022024)
03.07Eastern North Pacific Tropical Weather Outlook
03.07How Microsoft and Nvidia bet correctly to leapfrog Apple
03.07Acreage and stocks estimates push corn prices lower
03.07Lakamps research aims to use cattle genetics and microbiome information to make performance predictions
More »