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EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution
2014-07-18 10:37:01| electronicsweb Home Page
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled theGEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs)
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Category:Electronics and Electrical
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