Configured for handling 200 mm and 300 mm wafers, ELP300 Gen2 meets technology driven requirements of advanced packaging and 3D industry. Product provides means to directly create <5 µm vias and microstructures, addressing limitations of traditional photo-dielectrics and photolithography steppers. With Excimer laser ablation, alternative organic polymers can be used, which contain optimized mechanical, physical, thermal, and chemical properties to lower cure temperatures and CTE stresses.
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