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Tag: vias
VIAs new Isaiah x86/ARM hybrid CPU outperforms Intel in benchmarks but will it ever come to market?
2014-07-08 17:17:21| Extremetech
VIA is working on a new CPU design with an unveil planned for late August -- could this core be a combined ARM-x86 hybrid?
Copper Filled Vias for Thin Film Boards
2014-03-28 10:13:38| rfglobalnet Products
Copper filled vias offer several advantages over gold filled vias in relation to thermal and electrical conductivity. This makes them ideal for microelectronics providers, hybrid manufacturers, and in commercial packaging applications. As the price of gold has risen steadily over the last decade, copper also provides an advantage in overall cost.
Excimer Laser Stepper creates vias and microstructures.
2014-02-26 14:30:44| Industrial Newsroom - All News for Today
Configured for handling 200 mm and 300 mm wafers, ELP300 Gen2 meets technology driven requirements of advanced packaging and 3D industry. Product provides means to directly create <5 µm vias and microstructures, addressing limitations of traditional photo-dielectrics and photolithography steppers. With Excimer laser ablation, alternative organic polymers can be used, which contain optimized mechanical, physical, thermal, and chemical properties to lower cure temperatures and CTE stresses. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - Tile AdSearch for suppliers of: Wafer Processing Systems
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Recargo PlugShare software will be available in VIAs plug-ins
2014-01-14 15:35:34| Green Car Congress
ViaSystems Group (VIAS) Posts Quarterly Earnings, Misses Estimates By $0.34 EPS
2013-11-06 19:27:56| Electronics - Topix.net
ViaSystems Group released its earnings data on Wednesday. The company reported EPS for the quarter, missing the Thomson Reuters consensus estimate of $0.03 by $0.34, Analyst Ratings.Net reports.
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