Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields, while stencil print transfer efficiency suits diverse processes.