Indium Corporation’s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.<br />
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Dr. Liu’s presentation, An Innovative Composite Solder Preform for TLP Bonding -- Microstructure and Properties of Die-Attach Joints, discusses a special laminate composite preform developed for high temperature Pb-free soldering applications, where a melting temperature of 280°C or higher is required.<br ...