je.st
news
Non-Conductive Paste promotes flip chip application reliability.
2014-02-06 14:30:13| Industrial Newsroom - All News for Today
Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion. This story is related to the following:Solder Paste
Tags: application
chip
reliability
paste
Category:Industrial Goods and Services
Latest from this category |
All news |
||||||||||||||||||||
|
|
||||||||||||||||||||