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Home › Non-Conductive Paste promotes flip chip application reliability.

 

Non-Conductive Paste promotes flip chip application reliability.

2014-02-06 14:30:13| Industrial Newsroom - All News for Today

Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200°C, exhibits optimized fracture toughness as well as adhesion. This story is related to the following:Solder Paste

Tags: application chip reliability paste

Category:Industrial Goods and Services

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