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Home › Nordic Semiconductor And Japanese Partners Demonstrate Application Development-Ready Bluetooth Low Energy Modules At MWC 2013

 

Nordic Semiconductor And Japanese Partners Demonstrate Application Development-Ready Bluetooth Low Energy Modules At MWC 2013

2013-02-28 02:24:09| wirelessdesignonline News Articles

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA recently announces demonstrations of 'blank' Bluetooth low energy modules from Japanese suppliers on the company's booth (Hall 6, stand 6C70, the Norwegian Pavilion) at Mobile World Congress 2013.

Tags: low application partners energy

Category:Telecommunications

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