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Rudolph Receives JetStep Lithography System Order From Leading OSAT For Copper Pillar Bump And Fan-Out Wafer Level Packaging Applications

2015-07-10 03:23:23| metrologyworld Home Page

Rudolph Technologies, Inc. announced recently that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology

Tags: order system level applications

 

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

2015-04-30 12:31:11| Industrial Newsroom - All News for Today

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...

Tags: level orders applications inspection

 
 

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

2015-03-18 11:31:13| Industrial Newsroom - All News for Today

Tool to be used for development of copper pillar bumping and TSV processes Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep Advanced Packaging Lithography System for evaluation. The tool, which...

Tags: system advanced applications packaging

 

TDK Counts on Lithography Solutions from SUSS MicroTec

2015-02-27 11:45:30| Semiconductors - Topix.net

Delivery and installation will take place already in the first quarter 2015. Based in Tokyo, Japan, TDK develops, manufactures and markets, among others, electronic components, modules and systems, focusing on fast-growing leading-edge technology markets, which include information and communications technology, automotive electronics, industrial electronics and consumer electronics.

Tags: solutions counts tdk lithography

 

TMSC announces lithography milestone as EUV moves closer to production

2015-02-24 22:01:40| Extremetech

Extreme ultraviolet lithography is finally approaching commercial viability thanks to sustained power output of nearly 100W over a 24 hour period. There's a great deal of work yet to do, but this particular milestone is critical.

Tags: production closer moves announces

 

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