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ComEd to Present Potential Routes for New Transmission Line in Ogle, DeKalb, Kane and DuPage Counties

2013-10-02 18:24:00| Transmission & Distribution World

ComEd will host its third series of open houses to present the proposed routes for the Grand Prairie Gateway Project, a new high-voltage electric transmission line to be constructed between ComEd's existing substations near the communities of Byron and Wayne. read more

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Osborne Industries to Present Seminar at AmCon Design & Manufacturing Expo

2013-10-02 06:00:00| Industrial Newsroom - All News for Today

Osborne Industries, Inc., a manufacturer of custom-molded plastics via Reaction Injection Molding (RIM) and Resin Transfer Molding (RTM), announced it will be attending the AmCon Design Contract Manufacturing Expo. The expo is being held at the Wisconsin State Fair Park, Exposition Center, Hall A, in Milwaukee, Wisconsin, October 8-9, 2013. Osborne Industries can be found at booth # 118.<br /> <br /> George Eakin, President and CEO of Osborne Industries will present a seminar at the expo ...

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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

<a href="http://www.indium.com/">Indium Corporation</a>&rsquo;s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang&rsquo;s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...

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IPC and CALCE Present 7th International Symposium on Tin Whiskers

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

IPC and educational partner CALCE® (Center for Advanced Life Cycle Engineering) will host 7th International Symposium on Tin Whiskers. Event will take place November 12&ndash;13, 2013, in Costa Mesa, CA and feature opening keynote session, "Space: The Intolerant Final Frontier," as presented by Lockheed Martin's John Kowalchik. Afterwards, technical presentations will deliver in-depth look at causes of growth as well as risk mitigation, materials, detection, and failure analysis. This story is related to the following:Trade Associations

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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang&rsquo;s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...

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