je.st
news
Tag: interconnect
3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets
2014-03-23 16:24:44| Semiconductors - Topix.net
March 23, 2014 According to a new market research report "Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market - Global Forecast & Trend Analysis By Technology , Products & Applications ", the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016.
Spreadtrum Adopts Arteris FlexNoC Interconnect IP for Mobile Phone Processor and Baseband ...
2014-02-27 06:00:00| Industrial Newsroom - All News for Today
Network-on-chip technology to help enable single-chip application processor with digital baseband modem product line<br /> <br /> CAMPBELL, Calif. - Arteris Inc., the inventor and leading supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Spreadtrum Communications has licensed Arteris FlexNoC fabric IP for use in its sophisticated system-on-chip (SoC) product line.<br /> <br /> Spreadtrum chose Arteris FlexNoC for this product line after ...This story is related to the following:Central Processing Unit (CPU), Intellectual Property (IP), Microprocessor & Processor Cores
Tags: phone
mobile
mobile phone
processor
Interconnect Fabric IP cuts SoC development time.
2014-01-23 14:30:13| Industrial Newsroom - All News for Today
Embedded within FlexNoC interconnect IP fabric, FlexNoC Composition feature allows SoC architecture to be subdivided for implementation by various specialist design teams, each working independently on their own subsystem. Once all subsystems are complete, each can be integrated into one complete full chip-level FlexNoC interconnect fabric without requiring bridges. Unlike hybrid bus or crossbar, FlexNoC Composition re-connects each subsystem seamlessly through specialized low-latency protocol. This story is related to the following:Central Processing Unit (CPU), Intellectual Property (IP), Microprocessor & Processor Cores
Tags: time
development
fabric
cuts
Enhanced Interconnect Medium Simplifies Test & Verification
2013-11-14 15:39:34| rfglobalnet News Articles
In high performance embedded systems test application, the requirement for accurate measurement of AC and DC parameter is often critical. During development phase, IC devices are not permanently attached to the target board. Instead IC devices are connected via interconnect medium to the target board. By Ila Pal, Ironwood Electronics, Inc.
Tags: test
medium
enhanced
verification
Enhanced Interconnect Medium Simplifies Test & Verification
2013-11-14 15:39:34| wirelessdesignonline News Articles
In high performance embedded systems test application, the requirement for accurate measurement of AC and DC parameter is often critical. During development phase, IC devices are not permanently attached to the target board. Instead IC devices are connected via interconnect medium to the target board. By Ila Pal, Ironwood Electronics, Inc.
Tags: test
medium
enhanced
verification
Sites : [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] next »