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Tag: thermal

Agilent Technologies Announces New Handheld Thermal Imager and Insulation Resistance Testers ...

2014-06-02 06:00:00| Industrial Newsroom - All News for Today

SANTA CLARA, Calif.<br /> <br /> Agilent Technologies Inc. (NYSE: A) today announced the addition of two new ranges of instruments to its portfolio of handheld tools. The U5855A TrueIR thermal imager provides clear and sharp thermal images with its unique Fine Resolution capability. The U1450A/60A Series offers five models of insulation resistance testers with wireless testing and report generation capability.<br /> <br /> With the shift toward predictive maintenance, the U5855A TrueIR thermal ...This story is related to the following:Vision SystemsThermal Imaging Systems |

Tags: technologies resistance thermal announces

Easy Handling Thermal Compound

2014-05-27 06:00:00| Industrial Newsroom - All News for Today

Carteret, NJ &mdash; SARCON® SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material's high viscosity and ultra-low compression force are ideal for applications with gaps ranging from .30mm to 1.0mm.   <br /> <br /> Once applied, SARCON® SPG-30A delivers a ...This story is related to the following:Thermal Compounds

Tags: easy handling thermal compound

Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits

2014-05-23 17:51:25| Semiconductors - Topix.net

The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows.

Tags: standard interface integrated protocol

Thermal Analysis Engineer

2014-05-16 17:36:30| Space-careers.com Jobs RSS

Directorate of Technical and Quality Management The European Space Agency is an equal opportunity employer and encourages applications from women POST Thermal Analysis Engineer in the Thermal Analysis and Verification Section, Thermal Division, Mechanical Engineering Department, Directorate of Technical and Quality Management. This post is classified in the A2A4 grade band of the Coordinated Organisations salary scale. LOCATION ESTEC, Noordwijk The Netherlands. DUTIES The Thermal Analysis and Verification Section is responsible for providing technical support in the fields of thermal analysis and verification, interdisciplinary analysis in the thermalmechanical domain and product data exchange. The Section coordinates at European level the development of key thermal analysis software and of STEPTASbased libraries for the exchange of thermal models. The Section is also responsible for the Mechanical Systems Laboratory as well as the daytoday operation of the Mechanical Engineering Departments overall computing infrastructure. The postholder will report to the Head of the Thermal Analysis and Verification Section and the main tasks will include the following providing thermal support for the development and verification of spacecraft and associated payloads by executing various analyses in coordination with the Thermal Control Section participating in the definition and implementation of the ESA Technology Research and Development Programmes, with emphasis on thermal analysis and verification methods participating in the evaluation of industrial proposals and project reviews supporting the ESAESTEC Concurrent Design Facility in the development of its required thermal and interdisciplinary analysis tools within the thermalmechanical domain participating in the ECSS standardisation activities in the thermal analysis and verification domain. QUALIFICATIONS Applicants for this post should have a Masters degree or equivalent qualification in thermalmechanical engineering or a related field, together with a good knowledge of software engineering. A good knowledge of space thermal control engineering, as well as of overall spacecraft thermalmechanical development and verification is essential. Indepth knowledge, experience and interest in the area of thermal analysis methodologies is required as well as proven experience with thermal tools such as ESATANTMS. Candidates should have good interpersonal and communication skills. They should have the ability to work autonomously, effectively and cooperatively in a diverse and international team environment and to define and implement solutions in line with team and individual objectives and project deadlines. In addition, applicants should have good analytical, organisational and reporting skills, a proactive attitude to solving problems and an interest in innovative technologies. The working languages of the Agency are English and French. A good knowledge of one of these two languages is required together with a working knowledge of the other language. Knowledge of another member state language is an asset. CLOSING DATE The closing date for applications is 13 June 2014. Applications from external candidates for this position should preferably be made online at the ESA Web Site www.esa.intcareers. Those unable to apply online should submit their CV to the Head of the Human Resources Division, ESTEC, Keplerlaan 1, 2201 AZ Noordwijk ZH The Netherlands. The Agency may require applicants to undergo selection tests. Under ESA Regulations, the age limit for recruitment is 55. Please note that applications are only considered from nationals of one of the following States Austria, Belgium, the Czech Republic, Denmark, Finland, France, Germany, Greece, Ireland, Italy, Luxembourg, the Netherlands, Norway, Portugal, Romania, Spain, Sweden, Switzerland, the United Kingdom and Canada. Priority will be first given to internal candidates and secondly to external candidates from underrepresented member states. In accordance with the European Space Agencys security procedures and as part of the selection process, successful candidates will be required to undergo basic screening before appointment.

Tags: analysis engineer thermal thermal analysis

Thermal Imaging Camera enhances smartphone functionality.

2014-05-15 14:31:00| Industrial Newsroom - All News for Today

Consuming 0.5 W, modular Therm-App&trade; attaches to smartphone via USB to provide users in security, safety, construction, health, and other industries with thermal imaging and long-range night vision capabilities. Mobile device, complete with interchangeable lenses, combines fully functional thermal camera with mobility, processing power, display capabilities, and other features provided by smartphones. Camera can acquire images in field under any weather conditions. This story is related to the following:Optics and PhotonicsSearch for suppliers of: Imaging Cameras

Tags: camera functionality thermal imaging

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