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Indium Corporation Expert to Present at EPE

2015-07-20 12:31:09| Industrial Newsroom - All News for Today

Indium Corporations Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drivess (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland. Vijays presentation, Sn+ Heat-Spring Solder TIMs for Superior...

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Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

2015-07-06 12:31:11| Industrial Newsroom - All News for Today

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporations ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues...

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Indium Corporation's Patented BiAgX: A Drop-In Replacement for High-Pb Solders

2015-07-01 12:31:10| Industrial Newsroom - All News for Today

Indium Corporation's newly-patented BiAgX solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020  MSL1 preconditioning in specific devices without delamination. BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that...

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Indium Corporation and IMAPS Empire Chapter to Host "Advances in Semiconductor Packaging" Workshop in September

2015-06-23 12:31:08| Industrial Newsroom - All News for Today

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic...

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Indium Corporation Expert to Present at IPC Shanghai Technology Seminar

2015-06-19 12:31:07| Industrial Newsroom - All News for Today

Indium Corporations Aaron Yan, Area Technical Manager Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China. Yans presentation, High-Temperature Lead-free BiAgX Material, will discuss BiAgX a high-melting, lead-free (Pb-free) solder paste technology that is a...

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