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Indium Corporation Technical Expert to Present at IMAPS France Workshop
2015-01-09 11:30:57| Industrial Newsroom - All News for Today
Indium Corporations Graham Wilson, applications engineer, will present at the IMAPS France Workshop on Thermal Management in La Rochelle, France, on Feb. 5, 2015. Wilsons paper, Sn+ Heat-Spring Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform...
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Indium Corporation Technical Manager Presented at IPC Tianjin
2014-12-19 11:31:15| Industrial Newsroom - All News for Today
Indium Corporations Pony Liao, area technical manager for Northern China, presented at IPC Tianjin Technical Seminar on November 28. Liaos presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone...
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Indium Corporation Thermal Management Expert to Present at IMAPS UK Technical Conference
2014-09-24 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.<br /> <br /> Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will ...
Tags: management
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technical
corporation
Indium Corporation Soldering Technology Expert to Present at IMPACT 2014
2014-09-23 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan.<br /> <br /> Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys. This presentation explores the effects of BiSnAg, as a replacement for SAC solder alloys, on joint mechanical strength, drop test ...
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Indium Corporation Technology Expert to Present at Power and High-Temperature Electronics ...
2014-09-18 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation Technology Expert to Present at Power and High-Temperature Electronics Manufacturing Experience at SMTAI<br /> <br /> Indium Corporation’s Tim Jensen, senior product manager for engineered solders, will share his expertise at the Surface Mount Technology Association International’s (SMTAI) Power and High-Temperature Electronics Manufacturing Experience Sept. 30- Oct. 1 in Rosemont, Ill.<br /> <br /> High-Pb solders are still used in a large number of electronics ...
Tags: power
technology
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electronics
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