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Tag: microelectronic
UV Cure Adhesive suits microelectronic assembly applications.
2014-04-08 14:31:44| Industrial Newsroom - All News for Today
Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony. This story is related to the following:Ultraviolet (UV) Adhesives |
Tags: applications
assembly
cure
suits
Lids and Covers hermetically seal microelectronic devices.
2014-02-10 14:32:06| Industrial Newsroom - All News for Today
Available with screened or affixed getters for moisture or hydrogen absorption, Step Lids, Flat Lids, and Covers can be manufactured from variety of base materials, including Kovar, nickel alloys, stainless steel, cold rolled steel, titanium, and aluminum. Finishing/plating options include gold, electrolytic nickel, and electroless nickel. Selective plating or etching of logos, part numbers, or serialization is also available upon request. This story is related to the following:Packaging Products & EquipmentSearch for suppliers of: Metal Lids |
Tags: devices
covers
seal
lids
Epoxy Adhesive suits microelectronic assembly applications.
2014-01-14 14:30:45| Industrial Newsroom - All News for Today
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. This story is related to the following:Epoxy Adhesives
Tags: applications
assembly
suits
adhesive
Microelectronic Systems in Automobiles
2013-08-23 16:12:26| Semiconductors - Topix.net
The ESiP has been developed entailing a 35m, 9 countries and 40 partners. This system in package development has been developed and funded by public authorities in each of these 9 countries besides the ENIAC Joint Undertaking.
Tags: systems
automobiles
microelectronic
Aeroflex Announces New Vice President and COO for Aeroflex Microelectronic Solutions HiRel Businesses
2013-08-21 15:59:52| Semiconductors - Topix.net
Aeroflex Incorporated , a wholly owned subsidiary of Aeroflex Holding Corp. , today announced the appointment of Rafi Albarian to the newly created role of Vice President & Chief Operating Officer for Aeroflex Microelectronic Solutions - HiRel.
Tags: solutions
president
businesses
vice