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UV Cure Adhesive suits microelectronic assembly applications.
2013-05-31 14:31:38| Industrial Newsroom - All News for Today
Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain antimony. Product offers minimal stress, shrinkage, and glass transition temperature values.<br /> <br /> This story is related to the following:Ultraviolet (UV) Adhesives |
Tags: applications
assembly
cure
suits
Microelectronic Solutions Brochure
2013-01-11 16:04:02| rfglobalnet Downloads
This brochure provides an overview of API Technologies’ microelectronics capabilities, certifications and engineering, their facility, markets served, and detailed specifics on their microelectronics offerings
Tags: solutions
brochure
microelectronic
solutions brochure
Microelectronic Solutions
2013-01-11 16:02:26| rfglobalnet Products
API Technologies provides RF, Microwave and MMW solutions, Mixed Signal and Power solutions, optoelectronics and LED illumination solutions, 1153 Data Bus solutions, and other solutions in microelectronics for the communications, aerospace, industrial, and defense industries.
Tags: solutions
microelectronic