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Indium Corporation Technology Expert to Present at Yamaha Technology Day
2014-09-04 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.<br /> <br /> Bloching will present Miniaturization - Solder Paste Attributes for Maximizing the Print Reflow Manufacturing Process Window. This presentation discusses the development of an optimized flux technology platform to achieve print for small apertures; how to eliminate the head-in-pillow defect with an enhanced ...
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Indium Corporation Technology Expert to Lead Professional Development Course at SMTAi 2014
2014-08-05 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.<br /> <br /> Dr. Lee’s course, Properties and Applications of Low Temperature Solders, discusses the physical, mechanical, and soldering properties and applications of a variety of low temperature solders, with emphasis on ...
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Indium Corporation Technology Expert to Present at Assembly, Cleaning, and Reliability Workshop
2014-05-22 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.<br /> <br /> Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will ...
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Indium Corporation Technology Expert to Present at Brasage
2014-05-13 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.<br /> <br /> Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.<br /> <br /> For more information, visit afeit.asso.fr/brasage-2014.<br /> <br ...
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Indium Corporation Technology Expert to Present at SMTA Intermountain
2014-04-10 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Greg Wade, technical support engineer - global accounts, will present at the regional SMTA expo in Boise, Idaho on April 17.<br /> <br /> Wade’s presentation, How to Get the Most Out of Your Stencil Printing Process, will cover the latest techniques for creating a robust stencil printing process, including proactive maintenance, tooling do’s and don’ts, stencil technology, and 3D statistical analysis.<br /> <br /> For more information or to ...
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