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Henkel's New Game Changing Solder Paste Wins NPI Award
2015-03-23 11:31:17| Industrial Newsroom - All News for Today
The launch of Henkels much-anticipated game changing solder paste, LOCTITE GC 10, at the recent APEX event did not disappoint. Customers and booth visitors were intrigued and the industry took note. LOCTITE GC 10 is the markets first-ever temperature stable solder paste, an innovation that earned the material an...
Tags: game
changing
award
wins
Solder Paste is temperature stable at 26.5°C for 1 year.
2015-03-04 14:31:09| Industrial Newsroom - All News for Today
Halogen-free and lead-free, LOCTITE GC 10 enables abandon times of up to 24 hours and has startup time of 0. Product offers stabilized and consistent print transfer efficiency, expanded reflow window, and increased activity for optimum results with soak temperature from 150–200°C. Temperature stable up to 40°C for one month, paste eliminates requirement for cold packing, overnight shipping, and refrigerated storage.
Tags: year
temperature
stable
paste
Ribbon Blenders for Large-Scale Powder Blending, Paste Mixing and Vacuum Drying
2015-03-04 11:31:15| Industrial Newsroom - All News for Today
Hauppauge, NY Large-scale Ross Ribbon Blenders built up to 1,000 cu.ft. working capacity are ideal for high-volume production of powder blends, pastes and slurries. These versatile blenders can also function as vacuum dryers and are engineered for fast mixing, convenient discharge, easy cleaning and low...
Tags: paste
powder
vacuum
mixing
Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.
2015-03-02 14:31:06| Industrial Newsroom - All News for Today
Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-clean solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields, while stencil print transfer efficiency suits diverse processes.
Tags: paste
yields
improves
ict
Henkel to Debut New Solder Paste, Highlight Novel Protection and Thermal Materials at APEX 2015
2015-02-23 11:30:53| Industrial Newsroom - All News for Today
At the upcoming APEX event, set to take place February 24 26 in San Diego, California, The Electronics Group of Henkel plans to unveil a breakthrough solder material, showcase several novel innovations that are lending new levels of protection and performance to next-generation devices and introduce the line of...
Tags: protection
materials
highlight
thermal
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