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Tag: fanout
Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
2015-04-30 12:31:11| Industrial Newsroom - All News for Today
The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...
Tags: level
orders
applications
inspection
Kulicke & Soffa Joins High-Density Fan-Out Wafer Level Packaging Consortium
2015-04-18 13:21:54| Semiconductors - Topix.net
Through the collaboration, K&S is confident that with the combined experience and knowledge, the consortium will extend FOWLP capabilities for applications, such as tablets and smart phones, and provide solutions to overcome current FOWLP limitations. FOWLP enables multiple chips to be integrated in small form factor on a single package.
Tags: level
packaging
joins
consortium
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-05 11:30:34| Industrial Newsroom - All News for Today
Overall market growth drives semiconductor processing ramp and increased demand for Rudolphs JetStep Advanced Packaging Lithography System. Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has shipped the JetStep Advanced Packaging Lithography System to a leading outsourced...
Tags: system
applications
ships
packaging
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-02 15:58:22| Electronics - Topix.net
This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.
Tags: system
applications
ships
packaging
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-02 15:29:40| Semiconductors - Topix.net
This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.
Tags: system
applications
ships
packaging