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IPC Releases White Paper on conflict minerals due diligence.

2015-09-01 14:31:08| Industrial Newsroom - All News for Today

IPC-1081, Conflict Minerals Due Diligence White Paper, provides electronics industry with practical examples for developing conflict minerals compliance program within company. Designed to help with reporting, document also contains examples of information on where tin, tantalum, tungsten, and gold are used in electronics. Further discussion involves methods for engaging suppliers. Included tools and techniques help companies establish and sustain working relationship with suppliers.

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IPC Welcomes Wynne and Nickerson as senior directors.

2015-08-28 14:31:07| Industrial Newsroom - All News for Today

IPC – Association Connecting Electronics Industries® announced that Russell Wynne and Ayana Nickerson will respectively serve as senior director of IT/Software and senior director of training and certification programs at IPC headquarters in Bannockburn, IL. As IPC president and CEO, John Mitchell noted "wealth of knowledge and experience" brought by both Wynne and Nickerson that will "help IPC grow as an association and further enhance our members' success."

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IPC Seeks Technical Conference Abstracts for IPC APEX EXPO 2016.

2015-08-25 14:31:10| Industrial Newsroom - All News for Today

IPC invites researchers, academics, technical experts, and industry leaders to submit 300-word technical conference abstracts for IPC APEX EXPO 2016, which will take place March 15–17 in Las Vegas, NV. Papers and presentations are being sought on design, materials, assembly, processes, and equipment, and awards will be presented for "Best Paper" to recognize exceptional achievement. Deadline for technical conference paper abstracts is September 14, 2015.

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IPC Releases Amendment to printed board materials specification.

2015-08-24 14:31:07| Industrial Newsroom - All News for Today

As amendment to IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards, IPC-4101D-WAM1 delivers trending information for base materials used for rigid and multilayer printed boards. This revised standard, released by IPC, also covers requirements for laminate or prepreg base materials primarily used for rigid and multilayer printed boards for electrical and electronic circuits. There are also 64 individual, keyword-searchable specification sheets and one new table.

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IPC Arranges Visit between congressman, Juki Automation Systems.

2015-08-20 14:31:09| Industrial Newsroom - All News for Today

As coordinated by IPC, Congressman Mike Honda (D-Silicon Valley) met with executives and employees of Juki Automation Systems at its facility in Fremont, CA. During his visit, Rep. Honda toured said facility and met with staff to discuss current state of the manufacturing industry and such policy issues as federal efforts to develop National Network for Manufacturing Innovation (NNMI). Honda was active cosponsor of Revitalize American Manufacturing and Innovation Act, which authorized series of NNMI institutes to be established throughout USA.

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