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Tag: thermal
Laird Technologies Acquires Nextreme Thermal Solutions Technology
2013-02-19 05:09:29| wirelessdesignonline News Articles
Laird Technologies, Inc. (“Laird”), a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, recently announces the acquisition of Nextreme Thermal Solutions, Inc. (“Nextreme”), the US based developer of thin-film thermoelectric technologies.
Tags: technology
solutions
technologies
thermal
Thermal Imaging Camera Kit offers less than 50 mK sensitivity.
2013-02-18 14:29:32| Industrial Newsroom - All News for Today
Designed specifically for thermal benchtop testing applications, Model OSXL-A35SC contains both hardware and software for analyzing and verifying R/D projects. Instrument is equipped with uncooled micro bolometer detector and produces crisp thermal images of 320 x 256 pixels. Offering plug-and-play compatibility as well as support for GigE Vision and GenICam protocols, infrared camera can be fully configured from PC, which allows camera control and image capture in real-time. This story is related to the following:Vision SystemsSearch for suppliers of: Thermal Cameras |
Tags: offers
camera
kit
thermal
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| electronicsweb Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| rfglobalnet Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| electronicsweb Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
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