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Tag: solder
The Balver Zinn Group to Exhibit Bi Rework Solder Paste at APEX
2015-01-22 11:31:57| Industrial Newsroom - All News for Today
The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering...
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exhibit
paste
apex
Gowanda is First in Industry to Offer 0603/0805 QPL RF Chip Inductors with Tin/Lead Solder Terminations
2015-01-21 11:31:01| Industrial Newsroom - All News for Today
MLRF0603 MLRF0805 Sn/Pb Terminated Series Address Market Need for Solder-Friendly Components Gowanda, NY (USA) Gowanda Electronics, a US-based designer and manufacturer of precision electronic components for power and radio frequency applications, recently achieved qualification to the militarys MIL-PRF-83446...
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Gowanda Is First In Industry To Offer 0603/0805 QPL RF Chip Inductors With Tin/Lead Solder Terminations
2015-01-20 04:47:20| rfglobalnet Home Page
Gowanda Electronics, a US-based designer and manufacturer of precision electronic components for power and radio frequency applications, recently achieved qualification to the military’s MIL-PRF-83446 specification for its MLRF0603 and MLRF0805 series of RF surface mount wirewound coil, ceramic core chip inductors with tin/lead terminations.
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industry
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Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX
2015-01-14 11:31:13| Industrial Newsroom - All News for Today
Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1...
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corporation
paste
apex
YINCAE President, Dr. Wusheng Yin, Discusses Solder Joint Encapsulant and POP Assembly Solutions
2015-01-14 11:31:09| Industrial Newsroom - All News for Today
(Albany, NY) YINCAE Advanced Materials LLC, is now published in the Global SMT Packaging Magazine for January 2015 titled, Solder Joint Encapsulant Adhesive-POP Assembly Solution. This article explains extensively about solder joint encapsulant adhesives in comparison to traditional solder paste and the positive...
Tags: solutions
pop
president
joint
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