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Indium Corporation Features BiAgX(TM): New, High Temperature, Lead-Free Solder Paste ...

2014-03-04 05:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX&trade;, at Semicon China on March 18-20 in Shanghai, China.<br /> <br /> BiAgX&trade; was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.<br /> <br /> BiAgX&trade; is excellent for small, low-voltage QFN ...This story is related to the following:Lead-Free Solder |

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Nihon Superior's New General Purpose Solder Wire Wins a 2014 NPI Award

2014-03-01 05:00:00| Industrial Newsroom - All News for Today

OSAKA, JAPAN &mdash; Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire. The award was presented to Mr. Tetsuro Nishimura, company president, during a Tuesday, March 25, 2015 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO.<br /> <br /> SN100C (031) is a general purpose flux-cored ...This story is related to the following:Lead Free Wire | Solder Wire

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Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX

2014-02-25 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature its new technology platform using SACM&trade; solder paste at APEX March 25-27 in Las Vegas, Nevada.<br /> <br /> SACM&trade; is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM&trade; is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more ...This story is related to the following:Solder Paste

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Solder Pastes help reduce potential for tombstoning.

2014-02-11 14:32:02| Industrial Newsroom - All News for Today

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn, and Ag. No-clean and water-soluble, as well as lead-free and leaded formulations, are available. This story is related to the following:Flux Filled Solder | Solder Paste |

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Solder Paste Stencil is available for custom stencil designs.

2014-02-11 14:31:55| Industrial Newsroom - All News for Today

Able to be applied to existing production stencils, chemistry of NanoSlic® Gold coating imparts hydrophobic and oleophobic surface to apertures and underside of stencil; non-stick surface resists solder paste build-up and reduces cleaning cycle requirements.  Nano coating permanently bonds and conforms to aperture walls regardless of size or geometry. Abrasion surface withstands repeated cleaning, and paste release enables high-yield printing at low area SARs (surface area ratios). This story is related to the following:Paints and CoatingsSearch for suppliers of: Stencils | Coatings

Tags: custom designs paste stencil

 

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