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Speedline's MPM® EnclosedFlow(TM) Printing System Eliminates Solder Paste Compaction ...
2014-06-19 06:00:00| Industrial Newsroom - All News for Today
Franklin, Massachusetts, USA — Solder Paste compaction, a long-standing problem with pressurized enclosed media printing systems, has been eliminated with the MPM® EnclosedFlow™ printing system, it was announced today. The announcement follows a comprehensive program of exhaustive testing and customer production line evaluations. The EnclosedFlow was officially introduced to the market more than a year ago. Compaction of solder paste in an enclosed media system results, in part, ...This story is related to the following:Computer Hardware and PeripheralsSemiconductor Processing Equipment | Surface Mount Technology (SMT) Screen Printers
Tags: system
printing
paste
eliminates
Get True Solder Paste Measurement and Accurate Pre-reflow Inspection from CyberOptics at ...
2014-06-12 06:00:00| Industrial Newsroom - All News for Today
CyberOptics Corporation (Nasdaq: CYBE) announces that it will showcase the new QX150i™ AOI system in Booth D525 at NEPCON Thailand, scheduled to take place June 19-22, 2014 in the Singapore Pavilion. The multi-award winning SE600™ 3D SPI system and QX100™ tabletop AOI system also will be displayed at the show. All CyberOptics’ inspection solutions come with the assurance of quality, accuracy and speed.<br /> <br /> The new QX150i™ AOI system offers high value and ...This story is related to the following:Solder Paste Inspection Systems | 3D Inspection Systems
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true
accurate
measurement
Essemtec's SMT Assembler with Integrated Solder Paste Jet Printer Picks up an EM Asia ...
2014-04-29 06:00:00| Industrial Newsroom - All News for Today
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Pick-and-Place Systems (Multi-function) for its multi-functional SMT Center. The award was presented to the company during an April 24, 2014 ceremony at the Shanghai World Expo Exhibition Convention Center during NEPCON China. Essemtec is the first manufacturer that developed a combined SMT production center that is ...This story is related to the following:Computer Hardware and PeripheralsMaterial Handling and Storage Sponsored by: Dalmec Inc - Tile AdSearch for suppliers of: Printers | Dispensing Systems
Tags: printer
asia
integrated
jet
Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging
2014-04-29 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.<br /> <br /> SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, ...This story is related to the following:Solder Paste
Tags: features
corporation
packaging
paste
World's First SMT Assembler with Integrated Solder Paste Jet Printer from Essemtec Recognized ...
2014-03-26 05:00:00| Industrial Newsroom - All News for Today
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 NPI Award in the category of Component Placement – Multi-function for its multi-functional SMT Center. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO. Essemtec is the first manufacturer that developed a combined SMT production center that is ...This story is related to the following:Materials and Material ProcessingSurface Mount Technology Placement Systems | Printers | Solder
Tags: printer
integrated
recognized
jet
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