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Indium Corporation Hires Glen Thomas as Product Manager for Solder Paste

2014-01-29 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.<br /> <br /> Thomas is responsible for managing the company&rsquo;s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.<br /> <br /> Thomas has over 25 years of experience working with printed wiring ...

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Indium Corporation Announces Tim Jensen as Senior Product Manager for Engineered Solder Materials

2014-01-28 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation announces that Tim Jensen has been named the Senior Product Manager for Engineered Solders.<br /> <br /> Jensen is responsible for Indium Corporation&rsquo;s most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials. He is responsible for the overall success of the product line, including sales volume, profitability, the range of products, and Indium Corporation&rsquo;s strategic approach to the market. He is ...

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Essemtec to Introduce World's First SMT Assembler with Integrated Solder Paste Jet Printer at ...

2014-01-28 06:00:00| Industrial Newsroom - All News for Today

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will debut its new SMT production centre in booth #851 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.<br /> <br /> Two in One<br /> Jetting of solder paste instead of ...This story is related to the following:Printing and Duplicating EquipmentSearch for suppliers of: Surface Mount Assembly Equipment | Surface Mount Technology (SMT) Screen Printers |

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Solder Pastes come in lead-free, no-clean formulas.

2014-01-10 14:30:44| Industrial Newsroom - All News for Today

Lead-free SN100C P506 D4 can be stored at room temperature for more than 60 days without deterioration, while SN100C P820 D5 can suppress flux residue. With Alconano Nano-Silver Paste, users can join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without nitrous or sulphurous residues. Highly active surface of nano-silver particles make it possible to achieve strong bonds with electrical and thermal conductivity at low temperature without external pressure. This story is related to the following:Solder Paste

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Pb-Free Solder Paste delivers high first pass yields.

2013-12-16 14:30:45| Industrial Newsroom - All News for Today

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. This story is related to the following:Solder Paste

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