je.st
news
Tag: wafers
Positioning System aids inspection of large wafers.
2014-07-09 14:30:59| Industrial Newsroom - All News for Today
Designed to position wafers with diameter up to 12 in. using precise hold and repeat positioning, Wafer Positioning System can be used as automated inline controller or as stand-alone positioner. System offers positioning in microseconds with steps of few microns and repeatability in nanometers. Typical applications include semiconductor and solar production, lithography, display production, surface structuring, surface inspection, measurement chips, and quality control. This story is related to the following:Positioning Systems
Tags: system
large
aids
inspection
Electron Beam Metallization System suits 100 and 150 mm wafers.
2014-06-11 14:30:48| Industrial Newsroom - All News for Today
Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping capacity of 39,000 L/sec, UEFC-4900 can process up to 25 150 mm wafers/batch. This story is related to the following:Machinery and Machining Tools Sponsored by: AMT (IMTS) - Category Sponsor April2014Wafer Processing Systems | Electron Beam (EB) Machinery | Electron Beam Physical Vapor Deposition (EBPVD) Coating Equipment |
Tags: system
electron
beam
suits
Element Six's GaN-On-Diamond Wafers Proven By Raytheon To Provide Three Times Improvement In Power Density Versus GaN-On-SiC For RF Devices
2014-05-15 21:19:17| rfglobalnet Home Page
Element Six, the world leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.
Tags: provide
times
power
improvement
This is what the death of Moores law looks like: EUV paused indefinitely, 450mm wafers halted, and no path beyond 14nm
2014-03-17 18:50:59| Extremetech
There have been a number of events over the past few weeks that collectively point to serious problems ahead for the semiconductor market and all the players in that space. The entire economic structure that was supposed to support both Intel and the major foundries as they moved to next-generation manufacturing technologies, such as 450mm wafers, extreme ultraviolet lithography, and 20nm CMOS, is on the verge of coming apart.
Osram Is First Chip Manufacturer to Switch Red and Yellow LED Fabrication to 6-inch Wafers
2014-01-30 06:00:00| Industrial Newsroom - All News for Today
Osram Opto Semiconductors expands its capacity for InGaAlP LEDs<br /> <br /> Osram Opto Semiconductors is keeping pace with the constant growth of the market and switching its fabrication of red, orange and yellow light emitting diodes to 6-inch wafers. The German high-tech company is extending the fabrication of all large-wafer LEDs to the indium-gallium-aluminum-phosphide (InGaAlP) material system and expanding its production capacity. The company began switching fabrication of blue LED ...This story is related to the following:Display and Presentation EquipmentSearch for suppliers of: