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Soitec's RF SOI Wafers Now Mainstream in Mass Producing Smartphones' Switches
2013-07-10 06:00:00| Industrial Newsroom - All News for Today
SAN FRANCISCO – Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced at the Semicon West trade show that its silicon-on-insulator (SOI) technologies are now mainstream for manufacturing switches and antenna-tuners, key RF components used in all cell phones and tablet computers. According to the industry research firm Yole Developpement, more than 65 percent of substrates used in fabricating ...This story is related to the following:Substrates |
Tags: mass
producing
switches
mainstream
Transition to 450mm silicon wafers: impact on analog chips
2013-06-29 15:59:03| Semiconductors - Topix.net
The semiconductor industry is ramping up for its largest capital investment that it has undertaken in its history.
Tags: impact
transition
analog
chips
Epitaxial SiC Films Grown on 300mm Si Wafers
2013-05-29 06:00:00| Industrial Newsroom - All News for Today
Potentially an ultimate barrier film for GaN on silicon<br /> <br /> NEWPORT, England and BRISBANE, Australia -- The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on 300mm silicon wafers. This breakthrough is the result of over 10 years research at QMF on ...This story is related to the following:Film | Silicon Wafers
05.09.13 -- First Transistors Using GaN-On-Diamond Wafers Produced
2013-05-08 13:22:04| rfglobalnet News Articles
05/09/13 RF Globalnet Newsletter
Tags: produced
transistors
wafers
Infineon ships power ICs from floppy 300-mm wafers
2013-02-19 14:11:04| Semiconductors - Topix.net
Infineon Technologies AG has claimed it is the first and only company worldwide to produce power semiconductors on 300-millimeter thin wafers and that this will bring the company both a technical and cost advantage over its competition.