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Indium Corporation Features High-Reliability, Low-Voiding Flux Coating for Solder Preforms at ...

2014-08-21 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature LV1000 solder preform flux coating at the 47th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) Oct. 14-16 in San Diego, Calif.<br /> <br /> LV1000 is a high-reliability, low-voiding flux coating for solder preforms. It reduces ICT false failures while increasing productivity, throughput yields, and component performance. LV1000 is halide-free, meets the ROL0 requirement without ...This story is related to the following:Paints and CoatingsSearch for suppliers of: Soldering Flux | Coatings |

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Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability ...

2014-08-07 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Sze Pei Lim, technical manager &ndash; Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.<br /> <br /> Sze Pei will present Alloy and Process Optimization for Low-Ag Solders, which reviews the critical challenges associated with SAC305 solder alloy, including high processing temperatures, high cost and price volatility, and poor resistance to mechanical ...

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Indium Corporation's Andy Mackie Named President of IMAPS Empire Chapter

2014-08-06 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation announces that Andy C. Mackie, Ph.D., MSc, has been named president of the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS).<br /> <br /> IMAPS is the world&rsquo;s largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.<br /> <br /> Dr. Mackie&rsquo;s responsibilities as president include coordinating all activities for Empire Chapter members ...

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Indium Corporation's VP of Technology to Present at ICEPT 2014

2014-08-06 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.<br /> <br /> Dr. Lee&rsquo;s presentation, Reliability of BGA Assembly Alloys Containing BiSn Low-Melting Solders, explores the feasibility of replacing SAC solders with a low-temperature solder to potentially reduce materials cost. His evaluation is based on joint mechanical strength, drop test ...

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Indium Corporation Technology Expert to Lead Professional Development Course at SMTAi 2014

2014-08-05 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association&rsquo;s International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.<br /> <br /> Dr. Lee&rsquo;s course, Properties and Applications of Low Temperature Solders, discusses the physical, mechanical, and soldering properties and applications of a variety of low temperature solders, with emphasis on ...

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