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Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability
2013-11-07 06:00:00| Industrial Newsroom - All News for Today
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 - 14 in Costa Mesa, California.<br /> <br /> Dr. Ning-Cheng Lee, Vice President of Technology, will present Challenges for Migration toward Low Temperature Lead-Free Soldering. This presentation reviews the joint mechanical strength, drop test performance, and voiding performance of BGAs assembled with SAC105, SAC305, and BiSnAg.<br /> <br /> Dr. Ron Lasky, Senior ...
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Indium Corporation Technology Expert to Present at SMTA Penang
2013-11-06 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Sze Pei Lim, Technical Manager - Asia-Pacific Operations, will present at the SMTA Penang Expo and Tech Forum, November 8 in Penang, Malaysia.<br /> <br /> Sze Pei’s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.<br /> <br /> Sze Pei is responsible for ...
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expert
Indium Corporation's Technology Experts to Present at SMTA/iNEMI
2013-11-05 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.<br /> <br /> Dr. Lee’s presentation, Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn for Portable Medical Devices, discusses a new soldering alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.<br ...
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present
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corporations
Indium Corporation's Brook Sandy-Smith Awarded IPC Distinguished Committee Service Award
2013-10-31 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth, Texas on October 15.<br /> <br /> The award recognizes Sandy-Smith’s contributions toward the development of J-STD-006C, which provides requirements for electronics-grade solder alloys and fluxed and non-fluxed solid solders for electronics soldering applications. She has been an active ...
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committee
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awarded
Indium Corporation Features New, High-Reliability Solder Alloy SACM(TM) at Productronica
2013-10-29 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.<br /> <br /> SACM™ is a high-reliability solder alloy that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM is doped with manganese and contains less silver than other Pb-free alloys. The manganese provides increased strength, and the reduced silver content provides a more ...This story is related to the following:Electronic Solder | Solder Balls | Manganese Alloys
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