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Indium Corporation Technology Expert to Present at Brasage
2014-05-13 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.<br /> <br /> Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.<br /> <br /> For more information, visit afeit.asso.fr/brasage-2014.<br /> <br ...
Tags: technology
present
corporation
expert
Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability ...
2014-05-07 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.<br /> <br /> Sze Pei Lim, technical manager for Southeast Asia, will present Voiding and Reliability of BGA Assemblies with SAC and 57Bi/42Sn/1Ag Alloys. This presentation explores replacing SAC solders with BiSnAg as a low-cost solution and discusses joint mechanical strength, drop test performance, and voiding performance.<br /> <br /> Sehar Samiappan, area technical ...
Tags: high
technology
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corporation
Indium Corporation Expert to Present at International Conference on Soldering and Reliability
2014-05-06 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.<br /> <br /> Briggs’ presentation, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in ...
Tags: international
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conference
Indium Corporation Technology Experts to Present at PCIM Europe
2014-05-01 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany.<br /> <br /> Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present Void Reduction and Better Thermals with Engineered Flux-Coated Solder Preforms. This paper discusses unique attributes of flux-coated solder preforms and the enhanced manufacturing techniques that achieve consistent, controlled flux coverage over the entire surface of the preform. In all the ...
Tags: technology
present
europe
corporation
Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging
2014-04-29 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.<br /> <br /> SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, ...This story is related to the following:Solder Paste
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corporation
packaging
paste
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