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Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-05 11:30:34| Industrial Newsroom - All News for Today
Overall market growth drives semiconductor processing ramp and increased demand for Rudolphs JetStep Advanced Packaging Lithography System. Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has shipped the JetStep Advanced Packaging Lithography System to a leading outsourced...
Tags: system
applications
ships
packaging
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-02 15:58:22| Electronics - Topix.net
This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.
Tags: system
applications
ships
packaging
Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications
2015-02-02 15:29:40| Semiconductors - Topix.net
This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.
Tags: system
applications
ships
packaging
Rudolph Technologies Schedules 2014 Fourth Quarter and Full Year...
2015-01-20 04:33:03| Semiconductors - Topix.net
Rudolph Technologies, Inc. will release the 2014 fourth quarter and full year financial results, after the market closes on Monday, February 2, 2015. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the Internet.
Tags: year
full
technologies
fourth
Rudolph Gains Traction In Mobile Device Market With Multi-System Orders For Its MetaPULSE G Metrology System
2014-12-12 04:12:56| metrologyworld News Articles
Rudolph Technologies, Inc. announced recently that it has received multi-system orders from several customers for its latest MetaPULSE G metal metrology system in support of their mobile device components ramp
Tags: system
market
mobile
orders
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