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Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

2015-07-16 12:31:12| Industrial Newsroom - All News for Today

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyRudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan...

Tags: process partner improve corporation

 

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

2015-07-14 12:31:14| Industrial Newsroom - All News for Today

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...

Tags: order system level applications

 
 

Rudolph Receives JetStep Lithography System Order From Leading OSAT For Copper Pillar Bump And Fan-Out Wafer Level Packaging Applications

2015-07-10 03:23:23| metrologyworld Home Page

Rudolph Technologies, Inc. announced recently that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology

Tags: order system level applications

 

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

2015-06-25 12:31:09| Industrial Newsroom - All News for Today

F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes Flanders, New Jersey  - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that the leading MEMS company, Robert Bosch GmbH, has selected...

Tags: solutions dynamic inspection bosch

 

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

2015-04-30 12:31:11| Industrial Newsroom - All News for Today

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...

Tags: level orders applications inspection

 

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