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Tag: solder
Solder Paste minimizes post-process residue and graping.
2013-05-16 14:30:25| Industrial Newsroom - All News for Today
Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigating head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature. This story is related to the following:Solder Paste
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AIM Solder Announces The Release Of NC277 Solder Paste
2013-05-10 08:36:30| surfacefinishing News Articles
AIM Solder announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands
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announces
Water-Soluble Solder Paste minimizes voids.
2013-05-03 14:28:05| Industrial Newsroom - All News for Today
Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesFlux Filled Solder | Flux | Solder | Solder Paste Dispensers |
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minimizes
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Tin/Bismuth Solder Paste features low-melting formulation.
2013-05-02 14:28:18| Industrial Newsroom - All News for Today
With halide-free, rosin-based chemistry, NC722 no-clean solder paste can be used with low-temperature alloys, such as Sn42/Bi58, and lends repeatability and consistency to printing process. Product meets/exceeds requirements for ANSI/J-STD -004/-005 as well as all Bellcore test criteria for solder pastes and features non-hygroscopic, low voiding/high-reliability formulation suited for high RH areas. Residues left behind are clear and maintain virtually indefinite pin probability life. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesSearch for suppliers of: Solder Paste | Low Melting Alloys
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Indium Corporation's Engineered Solder Material Expert to Present at PCIM Europe
2013-04-30 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/karthik-vijay/">Karthik Vijay</a>, Technical Manager for Europe, Africa, and the Middle East, will present at <a href="http://www.mesago.de/en/PCIM/The_conference/Welcome/index.htm">PCIM Europe</a> 2013 at 10 a.m., Thursday, May 16 in Nuremberg, Germany. <br /> <br /> Karthik’s presentation, Solder TIMs (Thermal Interface Materials) for Superior Thermal Management in Power ...
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material
europe
expert
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