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The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany. Representatives from Balver Zinn and Cobar will display the company’s latest solder wire and paste technologies and services.<br /> <br /> OT2 is Cobar’s latest halide and halogen free solder paste technology that is specially developed to meet ...This story is related to the following:Green & CleanSelective Solder Soldering Equipment | Rosin Core Solder | Solder Paste | Soldering Machinery |
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wire
paste
brilliant
Halogen-Free Solder Paste offers consistent print performance.
2013-09-13 14:30:33| Industrial Newsroom - All News for Today
Optimized for use on components with pitches of 0.3 mm and greater, Loctite Multicore HF 212 contains zero deliberately added halogen and is under limit of detection for chlorine and bromine. Lead-free material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence, and optimal solderability over wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag, and OSP copper. In addition, paste has very low residues and minimal hot slump. This story is related to the following:Solder Paste
Tags: print
offers
performance
consistent
Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International
2013-09-01 06:00:00| Industrial Newsroom - All News for Today
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Representatives from Cobar will display the company’s latest solder wire and paste technologies, including BRILLIANT B2012 Solder Wire and OT2 Solder Paste.<br /> <br /> Balver Zinn’s BRILLIANT B2012 solder wire is halide-free, rosin based and designed for ...This story is related to the following:Soldering Flux | Solder Wire
Tags: international
technologies
wire
exhibit
Solder Alloy maximizes drop shock performance of electronics.
2013-08-15 14:30:48| Industrial Newsroom - All News for Today
Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling. This story is related to the following:Solder Balls |
Tags: performance
electronics
drop
shock
Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI
2013-08-01 06:00:00| Industrial Newsroom - All News for Today
OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental ...This story is related to the following:Wire Solder | Solder Paste |
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technology
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